Welcome to ICCSD 2026

2026 6th International Conference on Circuits, Systems and Devices (ICCSD 2026) will take place in Ningbo, China during November 13-15, 2026. Sponsored by Ningbo University, ICCSD 2026 will offer a distinguished interdisciplinary platform for researchers, practitioners, and educators to showcase and deliberate on the latest innovations, trends, and concerns, as well as the practical challenges faced and solutions adopted in the realms of Circuits, Devices, and Systems.

The conference agenda will feature keynote & invited speeches, oral and poster presentations, tutorials delivered by experts on cutting-edge topics, and special sessions aimed at enhancing the regular program with emerging topics of particular interest to the circuits, systems, and devices community. We eagerly anticipate your participation.

Topics of Interest

Topics for submission include, but are not limited to:

Track 1: Microelectronic Devices

  • Advanced Transistors (GAAFETs/ VSAFETs)
  • Wide Bandgap Semiconductor Devices
  • Quantum Devices
  • Compound Semiconductor Devices
  • Spintronic Devices

Track 2: Power Devices and Power Management

  • Insulated-Gate Bipolar Transistor (IGBT)
  • Power MOSFET
  • Silicon Carbide(SiC)
  • Nano Energy Devices
  • Energy Conversion Devices
  • Energy Harvesting Technology

Track 3: Sensors and Displays

  • Bio/Gas/Thermal/Voltage/Current Sensors
  • Vision Intelligence & Image Sensors
  • Acoustic Sensors
  • Display Technology & Devices
  • Photoelectric Conversion & Optical Fiber Sensing

Track 4: Electromagnetics & Microwave Devices

  • Power Amplifiers
  • Mixer & Microwave Sources
  • Terahertz Devices
  • Magnetic Devices
  • Electromagnetic Components
  • Antenna Design
  • Terahertz Sensing and Imaging
  • Computational Electromagnetics

Track 5: 3D Integration & Microsystems

  • System in Package(SiP)
  • Through Glass Via & Through Silicon Via
  • 3D Integration Technology
  • High Density Packaging
  • CAD Tools for Packing
  • Microelectromechanical Systems
  • Photoelectric Fusion Module

Track 6: Digital Devices & VLSI Physical Design

  • Nonvolatile Memory
  • Computing in Memory
  • Emerging Memory Technologies
  • Clock Generator and Management
  • Physical Modeling for VLSI Design
  • Placement & Routing Algorithm
  • Evaluation Methods for VLSI Reliability

Conference Proceedings

After a careful reviewing process, all accepted papers after proper registration and presentation, will be published by ICCSD Conference Proceedings.

MS Word Template Download   LaTex Template Download   Submission Link   Online Registration

Important Dates

Submission Deadline
Notification Date
Registration Deadline
Camera Ready

July 10th, 2026

August 10th, 2026

August 30th, 2026

October 20th, 2026